Hosted by RadTech NA, RadTech North America 2018 International Conference and Expo was successfully held in Chicago, Illinois, during May 7-9, 2018. Thousands of participants from all over the world, including USA, Australia, and France, Sweden, Switzerland and Germany, and Japan, China, Korea, Malaysia, Vietnam, Iran, Singapore, and Taiwan and Hong Kong regions participated in RadTech 2018 Conference and Expo. Above 80 companies attended the exhibition. More than 100 papers were arranged as oral lectures and posters.
The topics including UV LED Technology, 3D Printing Materials, Automotive, Cationic, Chemistry, Electron Beam, Equipment, Flooring, Photoinitiators, Printing + Packaging, Waterborne, Adhesion Promotion – Adhesives, New Technology Trends, Overcoming Challenges, New Materials, and others were mainly focused. Moreover, the area overviews by Gary Cohen (RadTech North America), Jun Nie (RadTech China), and Paul Kelly (Univar) were also arranged.
Over 20 Delegates from RadTech China, headed by President of RadTech Asia Organization, Vice President of RadTech China, Prof. Jun Nie from Beijing University of Chemical Technology, participated in the RadTech NA 2018 Conference and Expo in Chicago, including Beijing University of Chemical Technology, Beijing Normal University, Changzhou Tronly New Electronic Materials Co., Ltd., Hubei Gurun Technology Co., Ltd., Wraio Chemicals, CGN Daheng Electron Accelerator Technology Co., Ltd., King Brother Chem Co., Ltd., Jiangsu Tetra New Material Technology Co., Ltd., Chites Technology, UNIZ, and so on.